Seminar - Automotive Electronics Today: Quality, Safety and Security

The seminar will be given by Dr. Yervant Zorian, President, Synopsys Armenia, and Fellow and Chief Architect, Synopsys Inc., as part of the course "Trends in Electronics M."

  • Date: 25 May 2018

  • Event location: Room 4.1, School of Engineering and Architecture, viale Risorgimento 2, Bologna

Contact Name:

Contact Phone: + 39 051 209 3013

About the speaker

Dr. Zorian is Chief Architect and Fellow at Synopsys, as well as President of Synopsys Armenia. Formerly, he was Vice President and Chief Scientist of Virage Logic, Chief Technologist at LogicVision, and a Distinguished Member of Technical Staff at AT&T Bell Laboratories. He is currently the President of IEEE Test Technology Technical Council (TTTC), the founder of the IEEE 1500 Standardization Working Group, the Editor-in-Chief Emeritus of the IEEE Design and Test and Adjunct Professor at University of British Columbia. He served on the Board of Governors of Computer Society and CEDA, was the Vice President of IEEE Computer Society, and the General Chair of the 50th Design Automation Conference (DAC) and several other symposia and workshops.

Dr. Zorian holds 38 US patents, has authored four books, published over 350 refereed papers and received numerous best paper awards. A Fellow of the IEEE since 1999, Dr. Zorian was the 2005 recipient of the prestigious Industrial Pioneer Award for his contribution to BIST, and the 2006 recipient of the IEEE Hans Karlsson Award for diplomacy. He received the IEEE Distinguished Services Award for leading the TTTC, the IEEE Meritorious Award for outstanding contributions to EDA, and in 2014, the Republic of Armenia's National Medal of Science.

He received an MS degree in Computer Engineering from University of Southern California, a PhD in Electrical Engineering from McGill University, and an MBA from Wharton School of Business, University of Pennsylvania.

Abstract

Given today’s fast growing automotive electronics industry, this talk will discuss the implications of automotive quality, safety and security requirements on all aspects of the chip lifecycle: design, silicon bring-up, volume production, and particularly in-system test. Today’s automotive safety critical chips need multiple in-system self-test modes, such as power-on self-test and repair, periodic in-field self-test, advanced error correction, etc. This presentation will cover these specific in-system approaches and the benefits of selecting ISO 26262 certified solutions to meet functional safety and security requirements, while accelerating time to market for automotive chips.