Seminario: Scan Compression Techniques to Improve Test Time and Quality

Il seminario sarà tenuto dal Dr. Juergen Alt, Intel Corporation, nell'ambito del corso "Trends in Electronics M" della Laurea Magistrale in Ingegneria Elettronica, curriculum Electronics and Communication Science and Technology (ECST).

  • Data: dal 03 maggio 2017 alle 14:00 al 04 maggio 2017 alle 11:00

  • Luogo: Scuola di Ingegneria e Architettura, viale Risorgimento 2, Bologna

Contatto di riferimento:

Recapito telefonico per contatti: +39 051 2093013

Calendario dell'evento

  • mercoledì 3 maggio 2017, ore 14-17, Sala del Consiglio
  • giovedì 4 maggio 2017, ore 9-11, aula 5.1

 

About the speaker

Juergen Alt is with Intel Corporation based in Munich, Germany. He is responsible for Design-for-Test Methodology for Intel’s mobile business. Juergen is working in Design & Test, EDA-Software and Reliability since more than 20 years. In 1995 he received a PhD from University of Hannover, Germany and started his industrial career the same year with Siemens Semiconductors (later Infineon).

 

Abstract

The world of Microelectronics is characterized by decreasing feature sizes and by this faces a continuous increase of complexity. The development of scan compression techniques was a significant innovative step to address increasing complexity to test logic parts of microelectronic products. This seminar guides you through the basics of test and Design-for-Test. After a summary of scan test and Automated Test Pattern Generation (ATPG) focus is on scan compression as one of the most advanced Design-for-Test techniques. Different implementations as well as the theoretical limits of compression are discussed. Insights into practical implementation for industrial designs are given.